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1 Ergebnisse
1
Temperature Dependence Mechanical Characteristics of Ag All..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Liu, D.-S.
;
Wen, P.-C.
;
Zhuang, Z.-W.
.. - p. 157-158 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535550
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Temperature Dependence Mechanical Characteristics of Ag Alloy Wire and Corresponding Influence in Wire Bonding Procedure</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535550&Exemplar=1&LAN=DE A1 Liu, D.-S. A1 Wen, P.-C. A1 Zhuang, Z.-W. A1 Chao, Y. C. A1 Huang, P.-C. YR 2024 K1 Temperature measurement K1 Temperature dependence K1 Temperature distribution K1 Wires K1 Metals K1 Softening K1 Bonding K1 Ag alloy wire K1 Electronic materials K1 Temperature-dependence mechanical properties K1 Wire bonding SP 157 OP 158 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535550 DO https://doi.org/10.23919/ICEP61562.2024.10535550 SF ELIB - SuUB Bremen
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