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1 Ergebnisse
1
Cu Nanoparticle Sintering by Electrical Current:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Wu, Albert T.
;
Sheng, Tzu-Hao
;
Chao, Jui-Lin
.. - p. 107-108 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535551
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Cu Nanoparticle Sintering by Electrical Current</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535551&Exemplar=1&LAN=DE A1 Wu, Albert T. A1 Sheng, Tzu-Hao A1 Chao, Jui-Lin A1 Wang, Chang-Meng A1 Tseng, Watson YR 2024 K1 Nanoparticles K1 Resistance K1 Sintering K1 Proximity effects K1 Silicon K1 Copper K1 Current K1 Cu nanoparticle K1 Electrical current K1 Joule heating K1 Current crowding SP 107 OP 108 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535551 DO https://doi.org/10.23919/ICEP61562.2024.10535551 SF ELIB - SuUB Bremen
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