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1 Ergebnisse
1
Formation of SiO2 Bonding Interface using Perhydropolysilaz..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Takeuchi, Kai
;
Nemoto, Daiki
;
Suga, Tadatomo
. - p. 113-114 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535553
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Formation of SiO2 Bonding Interface using Perhydropolysilazane at Room Temperature</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535553&Exemplar=1&LAN=DE A1 Takeuchi, Kai A1 Nemoto, Daiki A1 Suga, Tadatomo A1 Higurashi, Eiji YR 2024 K1 Wafer bonding K1 Silicon compounds K1 Annealing K1 Adsorption K1 Oxidation K1 Plasmas K1 Polymers K1 polysilazane K1 wafer bonding K1 packaging SP 113 OP 114 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535553 DO https://doi.org/10.23919/ICEP61562.2024.10535553 SF ELIB - SuUB Bremen
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