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1 Ergebnisse
1
Low Dielectric Materials for High Frequency Semiconductor P..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Hsu, Meei-Yu
;
Lin, Chih-Hao
;
Chen, Kai-Chi
- p. 279-280 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535560
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Low Dielectric Materials for High Frequency Semiconductor Packaging Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535560&Exemplar=1&LAN=DE A1 Hsu, Meei-Yu A1 Lin, Chih-Hao A1 Chen, Kai-Chi YR 2024 K1 Silicon compounds K1 Temperature K1 Dielectric materials K1 Dielectric losses K1 Humidity K1 Packaging K1 Resins K1 Low dielectric loss K1 Thermosetting resin K1 High frequency K1 Semiconductor K1 Packaging material SP 279 OP 280 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535560 DO https://doi.org/10.23919/ICEP61562.2024.10535560 SF ELIB - SuUB Bremen
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