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1
Comparison of Mechanical Property and Thermal Cycling Lifet..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Ishikawa, Dai
;
Nakako, Hideo
;
Blank, Thomas
. - p. 313-314 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535568
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Comparison of Mechanical Property and Thermal Cycling Lifetime of Sintered Cu and Sintered Ag</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535568&Exemplar=1&LAN=DE A1 Ishikawa, Dai A1 Nakako, Hideo A1 Blank, Thomas A1 Steiner, Felix YR 2024 K1 Young's modulus K1 Thermal expansion K1 Temperature K1 Sintering K1 Fatigue K1 Mechanical factors K1 Reliability K1 Sintering paste (Cu, Ag) K1 Mechanical property K1 Thermal cycling reliability K1 Finite-element analysis K1 Simulation SP 313 OP 314 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535568 DO https://doi.org/10.23919/ICEP61562.2024.10535568 SF ELIB - SuUB Bremen
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