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1 Ergebnisse
1
Addressing Advanced IC Substrate Deformation and Pattern Di..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Chang, John
;
Shay, Corey
;
Webb, James
. - p. 71-72 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535570
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Addressing Advanced IC Substrate Deformation and Pattern Distortion using an Extremely Large Exposure Field Fine-Resolution Lithography System</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535570&Exemplar=1&LAN=DE A1 Chang, John A1 Shay, Corey A1 Webb, James A1 Chang, Timothy YR 2024 K1 Integrated circuits K1 Image resolution K1 Lithography K1 Multichip modules K1 Distortion K1 Substrates K1 Surface treatment K1 Fan-out Panel-level Packaging (FOPLP) K1 Overlay K1 Large Exposure Field K1 Fine Resolution SP 71 OP 72 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535570 DO https://doi.org/10.23919/ICEP61562.2024.10535570 SF ELIB - SuUB Bremen
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