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1 Ergebnisse
1
Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Yang, Hung-Chun
;
Lai, Wei-Hong
;
Kao, Chin-Li
.. - p. 151-152 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535572
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Investigation of Wafer Warpage Evolution Baesd on Fan-Out Chip-first Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535572&Exemplar=1&LAN=DE A1 Yang, Hung-Chun A1 Lai, Wei-Hong A1 Kao, Chin-Li A1 Wang, Chen-Chao A1 Hung, Chih-Pin YR 2024 K1 Semiconductor device modeling K1 Fabrication K1 Semiconductor device measurement K1 Simulation K1 Glass K1 Finite element analysis K1 Copper K1 Fan-out K1 Chip-first process K1 Wafer warpage K1 Finite element method SP 151 OP 152 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535572 DO https://doi.org/10.23919/ICEP61562.2024.10535572 SF ELIB - SuUB Bremen
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