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1 Ergebnisse
1
Non-Destructive Orientation Mapping with X-ray Diffraction ..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Hayashi, Y.
;
Kim, J.
;
Yabashi, M.
- p. 237-238 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535575
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Non-Destructive Orientation Mapping with X-ray Diffraction for Electronic Packaging Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535575&Exemplar=1&LAN=DE A1 Hayashi, Y. A1 Kim, J. A1 Yabashi, M. YR 2024 K1 Degradation K1 Visualization K1 X-ray scattering K1 Electron backscatter diffraction K1 Thermomechanical processes K1 X-ray diffraction K1 Lead K1 Solder K1 Characterization K1 Non-destructive K1 Orientation SP 237 OP 238 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535575 DO https://doi.org/10.23919/ICEP61562.2024.10535575 SF ELIB - SuUB Bremen
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