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1 Ergebnisse
1
Low Thermal Resistance Joint Using Lotus-type Cu/Solder Com..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Tatsumi, Hiroaki
;
Isono, Hiroshi
;
Hirase, Kana
.. - p. 51-52 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535580
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Low Thermal Resistance Joint Using Lotus-type Cu/Solder Composite</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535580&Exemplar=1&LAN=DE A1 Tatsumi, Hiroaki A1 Isono, Hiroshi A1 Hirase, Kana A1 Ide, Takuya A1 Nishikawa, Hiroshi YR 2024 K1 Thermal resistance K1 Multichip modules K1 Prototypes K1 Conductivity K1 Thermal conductivity K1 Electronic packaging thermal management K1 Thermal management K1 Cu/Solder composite K1 lotus-type porous copper K1 anisotropic microcomposite joint SP 51 OP 52 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535580 DO https://doi.org/10.23919/ICEP61562.2024.10535580 SF ELIB - SuUB Bremen
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