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1 Ergebnisse
1
Selective Cu Surface Activation for Cu-Sn Thermocompression..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Negishi, Ryo
;
Saito, Satoshi
;
Tomatsu, Itsuro
- p. 83-84 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535581
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Selective Cu Surface Activation for Cu-Sn Thermocompression Microbump Bonding Without Flux Deposition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535581&Exemplar=1&LAN=DE A1 Negishi, Ryo A1 Saito, Satoshi A1 Tomatsu, Itsuro YR 2024 K1 Cleaning K1 Plasmas K1 Compounds K1 Bonding K1 Surface treatment K1 Chemicals K1 Electronics packaging K1 Cu surface treatment K1 Selective deposition K1 Sn based bonding K1 Fluxless bonding K1 microbump bonding SP 83 OP 84 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535581 DO https://doi.org/10.23919/ICEP61562.2024.10535581 SF ELIB - SuUB Bremen
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