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1 Ergebnisse
1
Surface Modification by Wet Treatment for Low-Temperature C..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Chen, Yu-An
;
Ong, Jia-Juen
;
Chiu, Wei-Lan
.. - p. 115-116 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535588
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Surface Modification by Wet Treatment for Low-Temperature Cu/SiO2 Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535588&Exemplar=1&LAN=DE A1 Chen, Yu-An A1 Ong, Jia-Juen A1 Chiu, Wei-Lan A1 Chang, Hsiang-Hung A1 Chen, Chih YR 2024 K1 Three-dimensional displays K1 Surface resistance K1 Contact resistance K1 Surface roughness K1 Rough surfaces K1 Bonding K1 Surface treatment K1 3D IC integration K1 Cu/SiO2 hybrid bonding K1 Surface modification K1 Low temperature bonding K1 Interfacial analysis SP 115 OP 116 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535588 DO https://doi.org/10.23919/ICEP61562.2024.10535588 SF ELIB - SuUB Bremen
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