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1 Ergebnisse
1
Microstructure and Mechanical Properties of Type 8 Solder P..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Ku, Jun Ho
;
Rajendran, Sri Harini
;
Jung, Jae Pil
- p. 309-310 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535592
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Microstructure and Mechanical Properties of Type 8 Solder Paste for Mini-LED Assembly Using Laser-Assisted Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535592&Exemplar=1&LAN=DE A1 Ku, Jun Ho A1 Rajendran, Sri Harini A1 Jung, Jae Pil YR 2024 K1 Printing K1 Scanning electron microscopy K1 Spectroscopy K1 Powders K1 Power lasers K1 Aging K1 Mechanical factors K1 Sn3.0Ag0.5Cu (SAC305) K1 Mini LED K1 Laser-assisted bonding K1 Intermetallic compounds (IMCs) K1 Shear strength SP 309 OP 310 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535592 DO https://doi.org/10.23919/ICEP61562.2024.10535592 SF ELIB - SuUB Bremen
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