I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Plasma Cleaning and Thermal Compression Bonding of Indium B..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Kang, Kumin
;
Derakhshandeh, Jaber
;
Wendeln, Christian
... - p. 267-268 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535594
RT T1
2024 International Conference on Electronics Packaging (ICEP)
: T1
Plasma Cleaning and Thermal Compression Bonding of Indium Bumps as Superconducting Interconnects for Cryogenic and Quantum Computing Applications
UL https://suche.suub.uni-bremen.de/peid=ieee-10535594&Exemplar=1&LAN=DE A1 Kang, Kumin A1 Derakhshandeh, Jaber A1 Wendeln, Christian A1 Schmidt, Ralf A1 Hao-Yu A1 Shafahian, Ehsan A1 El-Mekki, Zaid A1 Cochet, Tom A1 Maehara, Masataka A1 Beyne, Eric YR 2024 K1 Quantum computing K1 Three-dimensional displays K1 Stacking K1 Cleaning K1 Plasmas K1 Superconducting epitaxial layers K1 Indium K1 Thermo-compression bonding K1 Intermetallic compound K1 plasma cleaning K1 3D die to wafer stacking K1 superconducting material K1 flip chip bonding SP 267 OP 268 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535594 DO https://doi.org/10.23919/ICEP61562.2024.10535594 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)