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1 Ergebnisse
1
Plasma Cleaning and Thermal Compression Bonding of Indium B..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Kang, Kumin
;
Derakhshandeh, Jaber
;
Wendeln, Christian
... - p. 267-268 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535594
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Plasma Cleaning and Thermal Compression Bonding of Indium Bumps as Superconducting Interconnects for Cryogenic and Quantum Computing Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535594&Exemplar=1&LAN=DE A1 Kang, Kumin A1 Derakhshandeh, Jaber A1 Wendeln, Christian A1 Schmidt, Ralf A1 Hao-Yu A1 Shafahian, Ehsan A1 El-Mekki, Zaid A1 Cochet, Tom A1 Maehara, Masataka A1 Beyne, Eric YR 2024 K1 Quantum computing K1 Three-dimensional displays K1 Stacking K1 Cleaning K1 Plasmas K1 Superconducting epitaxial layers K1 Indium K1 Thermo-compression bonding K1 Intermetallic compound K1 plasma cleaning K1 3D die to wafer stacking K1 superconducting material K1 flip chip bonding SP 267 OP 268 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535594 DO https://doi.org/10.23919/ICEP61562.2024.10535594 SF ELIB - SuUB Bremen
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