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1 Ergebnisse
1
High-speed Signal Transmission Rigid Substrate fabricated b..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Fujikawa, Wataru
;
Tamura, Rei
;
Matsumoto, Tadashi
. - p. 199-200 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535595
RT T1
2024 International Conference on Electronics Packaging (ICEP)
: T1
High-speed Signal Transmission Rigid Substrate fabricated by Silver-seed Copper Plating Technique
UL https://suche.suub.uni-bremen.de/peid=ieee-10535595&Exemplar=1&LAN=DE A1 Fujikawa, Wataru A1 Tamura, Rei A1 Matsumoto, Tadashi A1 Fukazawa, Norimasa YR 2024 K1 Wiring K1 Personal protective equipment K1 Power transmission lines K1 Dielectric losses K1 Surface morphology K1 Morphology K1 Plating K1 Printed Wiring boards (PWB) K1 Copper-Clad Laminates (CCL) K1 Silver-seed K1 High-Speed Transmission K1 Silver-Seed Semi-Additive Process (S-SAP) SP 199 OP 200 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535595 DO https://doi.org/10.23919/ICEP61562.2024.10535595 SF ELIB - SuUB Bremen
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