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1 Ergebnisse
1
The Enhancement in the Reliability of Nanotwinned Cu Redist..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Hung, Yu-Wen
;
Lin, Yi-Quan
;
Chen, Chih
- p. 103-104 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535596
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>The Enhancement in the Reliability of Nanotwinned Cu Redistribution Lines Passivated with Immersion Sn and Ag</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535596&Exemplar=1&LAN=DE A1 Hung, Yu-Wen A1 Lin, Yi-Quan A1 Chen, Chih YR 2024 K1 Resistance K1 Electromigration K1 Polyimides K1 Curing K1 Oxidation K1 Reliability K1 Passivation K1 Passivation layer K1 Nanotwinned Cu K1 RDLs K1 Thermal cycling test SP 103 OP 104 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535596 DO https://doi.org/10.23919/ICEP61562.2024.10535596 SF ELIB - SuUB Bremen
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