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1 Ergebnisse
1
RDL Embedded Coreless Substrate for Hetelogenious Integlati..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Takagi, Fusao
;
Fujita, Takashi
;
Kosugi, Masahiro
... - p. 187-188 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535601
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>RDL Embedded Coreless Substrate for Hetelogenious Integlation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535601&Exemplar=1&LAN=DE A1 Takagi, Fusao A1 Fujita, Takashi A1 Kosugi, Masahiro A1 Ishida, Hiroyuki A1 Kobayashi, Akane A1 Kiuchi, Shuji YR 2024 K1 Fabrication K1 TV K1 Organic materials K1 Multichip modules K1 Mechanical variables measurement K1 Finite element analysis K1 Substrates K1 Redistribution layer (RDL) K1 Embedded K1 Double side reinforced K1 Coreless substrate SP 187 OP 188 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535601 DO https://doi.org/10.23919/ICEP61562.2024.10535601 SF ELIB - SuUB Bremen
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