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1 Ergebnisse
1
Semiconductor Fan-Out Polymer Adhesion on Physical Vapor De..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Lin, Nien-Chun
;
Shih, Hsin-Chih
;
Tsai, Ching-I
... - p. 179-180 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535603
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535603&Exemplar=1&LAN=DE A1 Lin, Nien-Chun A1 Shih, Hsin-Chih A1 Tsai, Ching-I A1 Kao, Chin-Li A1 Wang, Chen-Chao A1 Hung, C.P. YR 2024 K1 Couplings K1 Temperature K1 Polyimides K1 Humidity effects K1 Reliability engineering K1 Copper K1 Delamination K1 Fan-Out K1 Humidity K1 interface strength SP 179 OP 180 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535603 DO https://doi.org/10.23919/ICEP61562.2024.10535603 SF ELIB - SuUB Bremen
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