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1 Ergebnisse
1
Effects of the Nanoporous Cu Interlayer on the Bonding Area..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Lu, Wan-Hsin
;
Chen, Chih
- p. 53-54 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535610
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Effects of the Nanoporous Cu Interlayer on the Bonding Area and Strength for Applications in Packaging of High Power Devices</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535610&Exemplar=1&LAN=DE A1 Lu, Wan-Hsin A1 Chen, Chih YR 2024 K1 Electric potential K1 Silicon carbide K1 Furnaces K1 Packaging K1 Nanoscale devices K1 Nanostructures K1 Copper K1 Nanoporous copper K1 nanotwinned copper K1 thermal interface materials SP 53 OP 54 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535610 DO https://doi.org/10.23919/ICEP61562.2024.10535610 SF ELIB - SuUB Bremen
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