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1 Ergebnisse
1
Template Stripping Process Combined With Polyimide and SiO2..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Koseki, Shogo
;
Ogino, Mika
;
Takeuchi, Kai
... - p. 129-130 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535611
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Template Stripping Process Combined With Polyimide and SiO2/Si Templates for Obtaining Smooth Au Surfaces</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535611&Exemplar=1&LAN=DE A1 Koseki, Shogo A1 Ogino, Mika A1 Takeuchi, Kai A1 Thu, Le Hac Huong A1 Matsumae, Takashi A1 Takagi, Hideki A1 Kurashima, Yuichi A1 Tsuda, Takahiro A1 Tokuhisa, Tomoaki A1 Shimizu, Toshikazu A1 Higurashi, Eiji YR 2024 K1 Gold K1 Smoothing methods K1 Temperature K1 Films K1 Polyimides K1 Surface roughness K1 Silicon K1 Surface smoothing K1 Au-Au bonding K1 Low-temperature bonding SP 129 OP 130 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535611 DO https://doi.org/10.23919/ICEP61562.2024.10535611 SF ELIB - SuUB Bremen
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