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1 Ergebnisse
1
Large Area Powermodule Sintering Using Porous Copper:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Blank, Thomas
;
Steiner, Felix
;
Ishikawa, Dai
. - p. 43-44 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535613
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Large Area Powermodule Sintering Using Porous Copper</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535613&Exemplar=1&LAN=DE A1 Blank, Thomas A1 Steiner, Felix A1 Ishikawa, Dai A1 Nakako, Hideo YR 2024 K1 Temperature distribution K1 Electric shock K1 Sintering K1 Thermal shock K1 Multichip modules K1 Thick films K1 Copper K1 Power Modules K1 Large Area Copper Sintering Cu K1 Thick-film Copper K1 Pores SP 43 OP 44 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535613 DO https://doi.org/10.23919/ICEP61562.2024.10535613 SF ELIB - SuUB Bremen
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