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1 Ergebnisse
1
Physical and Thermal Characteristics of the Advanced Packag..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Mitarai, S.
;
Adachi, K.
;
Igarashi, T.
... - p. 173-174 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535616
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Physical and Thermal Characteristics of the Advanced Package with Glass Core Substrate</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535616&Exemplar=1&LAN=DE A1 Mitarai, S. A1 Adachi, K. A1 Igarashi, T. A1 Seki, K. A1 Kakoiyama, N. A1 Tanaka, Y. A1 Oka, S. A1 Nakazawa, M. A1 Iwamoto, H. YR 2024 K1 Temperature dependence K1 Temperature K1 Multichip modules K1 Moisture K1 Focusing K1 Glass K1 Electronic packaging thermal management K1 Glass core substrate K1 chip warpage K1 reliability K1 thermal cycle K1 SeWaRe SP 173 OP 174 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535616 DO https://doi.org/10.23919/ICEP61562.2024.10535616 SF ELIB - SuUB Bremen
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