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1 Ergebnisse
1
Design and Evaluation of On-Chip Terahertz Wave Power Combi..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Kamiura, Y.
;
Ssali, H.
;
Agemori, H.
... - p. 261-262 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535617
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Design and Evaluation of On-Chip Terahertz Wave Power Combiner for Beyond 5G/6G</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535617&Exemplar=1&LAN=DE A1 Kamiura, Y. A1 Ssali, H. A1 Agemori, H. A1 Doi, R. A1 Che, M. A1 Mikami, Y. A1 Kato, K. YR 2024 K1 Microstrip antenna arrays K1 Semiconductor device measurement K1 Wave power K1 Silicon carbide K1 Terahertz radiation K1 Microstrip antennas K1 Thermal conductivity K1 Microstrip antenna K1 terahertz wave K1 unitravelling carrier photodiode (UTC-PD) K1 array photomixing K1 Silicon Carbide SP 261 OP 262 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535617 DO https://doi.org/10.23919/ICEP61562.2024.10535617 SF ELIB - SuUB Bremen
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