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1 Ergebnisse
1
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloy:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Tan, Xin F.
;
Hao, Qichao
;
Zhou, Jiye
... - p. 207-208 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535619
RT T1
2024 International Conference on Electronics Packaging (ICEP)
: T1
Temperature-Dependent Electrical Resistivity in Sn-Bi Alloys
UL https://suche.suub.uni-bremen.de/peid=ieee-10535619&Exemplar=1&LAN=DE A1 Tan, Xin F. A1 Hao, Qichao A1 Zhou, Jiye A1 McDonald, Stuart D. A1 Sweatman, Keith A1 Nogita, Kazuhiro YR 2024 K1 Resistance K1 Manufacturing industries K1 Temperature distribution K1 Metals K1 Conductivity K1 Solids K1 Nickel K1 Electronics packaging K1 low temperature solder K1 Sn-Bi alloys K1 electrical resistivity SP 207 OP 208 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535619 DO https://doi.org/10.23919/ICEP61562.2024.10535619 SF ELIB - SuUB Bremen
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