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1 Ergebnisse
1
Improvement of the Bonding Reliability of Electroless Thin-..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Kawasaki, Kana
;
Saito, Ryuji
;
Nagao, Toshimitsu
. - p. 133-134 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535621
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Improvement of the Bonding Reliability of Electroless Thin-film Ni/Au Plating Using Co Activation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535621&Exemplar=1&LAN=DE A1 Kawasaki, Kana A1 Saito, Ryuji A1 Nagao, Toshimitsu A1 Hara, Kenji YR 2024 K1 Gold K1 Plating K1 Reliability K1 Bonding K1 Soldering K1 Finishing K1 Electronics packaging K1 Co activation K1 Electroless thin-film Ni/Au plating K1 Void-free K1 Solder joint K1 Fine pattern SP 133 OP 134 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535621 DO https://doi.org/10.23919/ICEP61562.2024.10535621 SF ELIB - SuUB Bremen
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