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1 Ergebnisse
1
Advanced TIM Material Analysis for High Performance Package..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Jhan, Jyun-De
;
Teng, Wen-Yu
;
Hung, Liang-Yih
.. - p. 229-230 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535622
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Advanced TIM Material Analysis for High Performance Package Applications</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535622&Exemplar=1&LAN=DE A1 Jhan, Jyun-De A1 Teng, Wen-Yu A1 Hung, Liang-Yih A1 Chen, Carl A1 Wang, Yu-Po YR 2024 K1 Silver K1 Semiconductor device measurement K1 Sintering K1 Elastomers K1 Conductivity K1 Thermal conductivity K1 Electronic packaging thermal management K1 Thermal interface material K1 core-shell filler K1 epoxy K1 low modulus K1 sintering silver SP 229 OP 230 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535622 DO https://doi.org/10.23919/ICEP61562.2024.10535622 SF ELIB - SuUB Bremen
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