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1 Ergebnisse
1
Advanced Fan-Out Embedded Chip Process Integration for 3D A..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Hsiao, Chih-Cheng
;
Hsu, Chao-Kai
;
Li, Ching-Iang
... - p. 181-182 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535623
RT T1
2024 International Conference on Electronics Packaging (ICEP)
: T1
Advanced Fan-Out Embedded Chip Process Integration for 3D Application
UL https://suche.suub.uni-bremen.de/peid=ieee-10535623&Exemplar=1&LAN=DE A1 Hsiao, Chih-Cheng A1 Hsu, Chao-Kai A1 Li, Ching-Iang A1 Chang, Yung-Sheng A1 Dai, Ming-Ji A1 Lo, Feng-Hsiang A1 Wang, Chin-Hung A1 Lo, Wei-Chung YR 2024 K1 Three-dimensional displays K1 Endoscopes K1 Semiconductor device reliability K1 Switches K1 Production K1 Packaging K1 Inspection K1 Fan-out wafer level packaging K1 Embedded chip K1 Through mold via SP 181 OP 182 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535623 DO https://doi.org/10.23919/ICEP61562.2024.10535623 SF ELIB - SuUB Bremen
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