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1 Ergebnisse
1
Quantitative Elemental Characterization for Electroless Cu ..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Nishijima, Masahiko
;
Hsieh, Ming-Chun
;
Zheng, Zhang
... - p. 11-12 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535624
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Quantitative Elemental Characterization for Electroless Cu Plating Interface of Micro-via by ToF-SIMS</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535624&Exemplar=1&LAN=DE A1 Nishijima, Masahiko A1 Hsieh, Ming-Chun A1 Zheng, Zhang A1 Okumuara, Rieko A1 Suetake, Aiji A1 Yoshida, Hiroyoshi A1 Chen, Chuantong A1 Seto, Hiroaki A1 Kitahara, Yuhei A1 Hashizume, Kei A1 Suganuma, Katsuaki YR 2024 K1 Electric potential K1 Hydrogen K1 Plating K1 Mass spectroscopy K1 Ions K1 Combustion K1 Reliability K1 Cu micro-via K1 electro less Cu deposition K1 TOF-SIMS SP 11 OP 12 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535624 DO https://doi.org/10.23919/ICEP61562.2024.10535624 SF ELIB - SuUB Bremen
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