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1 Ergebnisse
1
High Temperature Hygroscopic Swelling of Polymers in Electr..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Chin, Ian
;
Loh, Wei Keat
;
Keel, Seow Chien
... - p. 59-60 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535629
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>High Temperature Hygroscopic Swelling of Polymers in Electronic Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535629&Exemplar=1&LAN=DE A1 Chin, Ian A1 Loh, Wei Keat A1 Keel, Seow Chien A1 He, Yi A1 Abdullah, Mohd Zulkifly A1 Tsuriya, Masahiro YR 2024 K1 Temperature measurement K1 Temperature K1 Digital images K1 Moisture K1 Resists K1 Electromagnetic compatibility K1 Dielectric measurement K1 Digital image correlation K1 moisture K1 hygroscopic swelling K1 electronic packaging K1 polymer SP 59 OP 60 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535629 DO https://doi.org/10.23919/ICEP61562.2024.10535629 SF ELIB - SuUB Bremen
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