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1 Ergebnisse
1
Development of Laminate Materials with Low $D_{\mathrm{f}}$..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Yamamoto, H.
;
Iwase, K.
;
Fukuoka, H.
.. - p. 293-294 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535638
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Development of Laminate Materials with Low $D_{\mathrm{f}}$ using Novel Functionalized PPE</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535638&Exemplar=1&LAN=DE A1 Yamamoto, H. A1 Iwase, K. A1 Fukuoka, H. A1 Otani, S. A1 Harada, M. YR 2024 K1 Personal protective equipment K1 Resistance K1 Frequency dependence K1 Glass K1 Curing K1 Polymers K1 Laminates K1 laminate K1 5G K1 PPE K1 PWB SP 293 OP 294 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535638 DO https://doi.org/10.23919/ICEP61562.2024.10535638 SF ELIB - SuUB Bremen
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