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1 Ergebnisse
1
Development of Thermal Characteristics Evaluation System fo..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Huo, Fupeng
;
Chen, Chuantong
;
Zhang, Zheng
... - p. 47-48 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535640
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Development of Thermal Characteristics Evaluation System for Multi-Chip SiC Power Modules</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535640&Exemplar=1&LAN=DE A1 Huo, Fupeng A1 Chen, Chuantong A1 Zhang, Zheng A1 Suetake, Aiji A1 Takeshita, Kazutaka A1 Yamaguchi, Yoshiji A1 Momose, Yashima A1 Suganuma, Katsuaki YR 2024 K1 Temperature K1 Silicon carbide K1 Simulation K1 Multichip modules K1 Materials reliability K1 Market research K1 Power electronics K1 SiC K1 multi-chip K1 simulation K1 thermal interference SP 47 OP 48 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535640 DO https://doi.org/10.23919/ICEP61562.2024.10535640 SF ELIB - SuUB Bremen
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