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1 Ergebnisse
1
Bonding Parameter-Dependent Microstructural and Mechanical ..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Kim, YehRi
;
Jo, Eunjin
;
Ju, Byeong Kwon
... - p. 145-146 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535641
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Bonding Parameter-Dependent Microstructural and Mechanical Capabilities of Ag Porous Sheet Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535641&Exemplar=1&LAN=DE A1 Kim, YehRi A1 Jo, Eunjin A1 Ju, Byeong Kwon A1 Lee, Yoongul A1 Kim, Jaeup A1 Ahn, Kijoon A1 Kim, Dongjin YR 2024 K1 Temperature K1 Sintering K1 Pressing K1 Mechanical factors K1 Microstructure K1 Bonding K1 Surface finishing K1 Ag porous sheet K1 sheet bonding K1 power module K1 pressure bonding process K1 mechanical strength SP 145 OP 146 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535641 DO https://doi.org/10.23919/ICEP61562.2024.10535641 SF ELIB - SuUB Bremen
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