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1 Ergebnisse
1
Direct bonding of Germanium and Diamond substrates by reduc..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Minowa, Yuki
;
Matsumae, Takashi
;
Hayase, Masanori
.. - p. 119-120 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535650
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Direct bonding of Germanium and Diamond substrates by reduction process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535650&Exemplar=1&LAN=DE A1 Minowa, Yuki A1 Matsumae, Takashi A1 Hayase, Masanori A1 Kurashima, Yuichi A1 Takagi, Hideki YR 2024 K1 Performance evaluation K1 Heating systems K1 Diamonds K1 Germanium K1 Bonding K1 Substrates K1 Surface treatment K1 diamond K1 direct bonding K1 reduction process K1 hydrophilic bonding SP 119 OP 120 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535650 DO https://doi.org/10.23919/ICEP61562.2024.10535650 SF ELIB - SuUB Bremen
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