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1 Ergebnisse
1
In-situ observations of CU6Sn5 mophological changes at the ..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Nogita, Kazuhiro
;
Tan, Xin F.
;
Somidin, Flora
... - p. 215-216 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535651
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>In-situ observations of CU6Sn5 mophological changes at the liquid SAC305/ solid OSP-Cu interface</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535651&Exemplar=1&LAN=DE A1 Nogita, Kazuhiro A1 Tan, Xin F. A1 Somidin, Flora A1 McDonald, Stuart D. A1 Maeno, Hiroshi A1 Matsumura, Syo YR 2024 K1 Temperature sensors K1 Liquids K1 Transmission electron microscopy K1 Microscopy K1 Synchrotrons K1 Metals K1 Morphology K1 Electronics packaging K1 Pb-free solder K1 intermetallic compounds K1 high-voltage transmission electron microscopy SP 215 OP 216 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535651 DO https://doi.org/10.23919/ICEP61562.2024.10535651 SF ELIB - SuUB Bremen
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