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1 Ergebnisse
1
Lead-Free Diffusion Bonding for High Temperature Using ZnAl..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Ikeda, Toru
;
Kurakazu, Tomoki
;
Koganemaru, Masaaki
. - p. 99-100 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535652
RT T1
2024 International Conference on Electronics Packaging (ICEP)
: T1
Lead-Free Diffusion Bonding for High Temperature Using ZnAl Eutectic Alloy
UL https://suche.suub.uni-bremen.de/peid=ieee-10535652&Exemplar=1&LAN=DE A1 Ikeda, Toru A1 Kurakazu, Tomoki A1 Koganemaru, Masaaki A1 Nishimura, Tetsuro YR 2024 K1 Heating systems K1 Grain size K1 Heat treatment K1 Force K1 Pressing K1 Lead K1 Fatigue K1 ZnAl eutectoid alloy K1 Pb-free Solder K1 Superplasticity K1 SiC power semiconductor devices K1 Diffusion bonding SP 99 OP 100 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535652 DO https://doi.org/10.23919/ICEP61562.2024.10535652 SF ELIB - SuUB Bremen
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