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1 Ergebnisse
1
Investigation into the Impact of Layout Design on Thermal P..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Chen, Tang-Yuan
;
Chen, Dao-Long
;
Chiu, Frank
.. - p. 249-250 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535653
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Investigation into the Impact of Layout Design on Thermal Performance in Embedded-Die Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535653&Exemplar=1&LAN=DE A1 Chen, Tang-Yuan A1 Chen, Dao-Long A1 Chiu, Frank A1 Wang, Chen-Chao A1 Hung, Chin-Pin YR 2024 K1 Performance evaluation K1 Fabrication K1 Power system management K1 Layout K1 Packaging K1 Electronic packaging thermal management K1 Thermal management K1 Embedded die in substrate (EDS) K1 Thermal Manager K1 Fabrication Flow SP 249 OP 250 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535653 DO https://doi.org/10.23919/ICEP61562.2024.10535653 SF ELIB - SuUB Bremen
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