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1 Ergebnisse
1
High Speed D2D Interface Applied on Advanced Package:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Wang, Chen Chao
;
Huang, Chih Yi
;
Kuo, Hung Chun
... - p. 269-270 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535662
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>High Speed D2D Interface Applied on Advanced Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535662&Exemplar=1&LAN=DE A1 Wang, Chen Chao A1 Huang, Chih Yi A1 Kuo, Hung Chun A1 Jhong, Ming Fong A1 Chu, Fu Chen A1 Lee, Hsu Yang YR 2024 K1 Application specific integrated circuits K1 Fans K1 High performance computing K1 Integrated circuit interconnections K1 Bandwidth K1 Routing K1 Device-to-device communication K1 Chiplets K1 UCIe K1 HBM3 K1 FOCoS K1 heterogeneous integration SP 269 OP 270 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535662 DO https://doi.org/10.23919/ICEP61562.2024.10535662 SF ELIB - SuUB Bremen
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