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1 Ergebnisse
1
Optimal Impedance Design for Meshed Ground Application at H..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Hung, Shin-Yi
;
Wu, Sung-Mao
- p. 295-296 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535669
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Optimal Impedance Design for Meshed Ground Application at High-Speed Circuit</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535669&Exemplar=1&LAN=DE A1 Hung, Shin-Yi A1 Wu, Sung-Mao YR 2024 K1 Resistance K1 Grounding K1 Printed circuits K1 Voltage K1 Impedance K1 Copper K1 Integrated circuit modeling K1 meshed copper ground planes K1 a method for calculating transmission line impedance SP 295 OP 296 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535669 DO https://doi.org/10.23919/ICEP61562.2024.10535669 SF ELIB - SuUB Bremen
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