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1 Ergebnisse
1
Low-Temperature and Low-Pressure Fine-Pitch Micro Cu Bump B..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Zhang, Zheng
;
Suetake, Aiji
;
Liu, Ran
... - p. 311-312 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535678
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Low-Temperature and Low-Pressure Fine-Pitch Micro Cu Bump Bonding Using Stress Migration of a Sputtering Ag Layer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535678&Exemplar=1&LAN=DE A1 Zhang, Zheng A1 Suetake, Aiji A1 Liu, Ran A1 Yoshida, Hiroshi A1 Okumura, Rieko A1 Chen, Chuantong A1 Suganuma, Katsuaki YR 2024 K1 Silver K1 Pressure effects K1 Silicon K1 Copper K1 Bonding K1 Sputtering K1 Stress K1 Fine-pitch interconnect K1 Cu bump K1 Stress migration bonding SP 311 OP 312 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535678 DO https://doi.org/10.23919/ICEP61562.2024.10535678 SF ELIB - SuUB Bremen
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