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Approach for Advanced Packaging for 2.5D/3D Chiplets:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Kubota, T.
;
Oshida, H.
;
Hayashiguchi, S.
. - p. 177-178 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535681
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Approach for Advanced Packaging for 2.5D/3D Chiplets</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535681&Exemplar=1&LAN=DE A1 Kubota, T. A1 Oshida, H. A1 Hayashiguchi, S. A1 Kajikawa, Y. YR 2024 K1 Heating systems K1 Costs K1 Vacuum technology K1 Packaging K1 Curing K1 Cows K1 Resins K1 Compression Molding K1 WLP/PLP K1 MUF K1 2.5D/3D K1 CHIPLET SP 177 OP 178 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535681 DO https://doi.org/10.23919/ICEP61562.2024.10535681 SF ELIB - SuUB Bremen
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