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Development of Next-Generation Distortion Correction Techno..:

, In: 2024 International Conference on Electronics Packaging (ICEP),

Mitsuishi, Hajime ; Mori, Hiroshi ; Maeda, Hidehiro... - p. 1-2 , 2024

Link: https://doi.org/10.23919/ICEP61562.2024.10535682

RT 
T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Development of Next-Generation Distortion Correction Technologies for High-Precision Wafer-to-Wafer Bonding</Title>

UL https://suche.suub.uni-bremen.de/peid=ieee-10535682&Exemplar=1&LAN=DE
				
A1 Mitsuishi, Hajime
A1 Mori, Hiroshi
A1 Maeda, Hidehiro
A1 Ushijima, Mikio
A1 Kamashita, Atsushi
A1 Okada, Masashi
A1 Aramata, Masanori
A1 Shiomi, Takashi
A1 Sakamoto, Shinya
A1 Takahata, Kishou
A1 Chiba, Tomohiro
A1 Fukuda, Minoru
A1 Kanbayashi, Masahiro
A1 Shimoda, Toshimasa
A1 Sugaya, Isao
YR 2024
K1 Fabrication
K1 Three-dimensional displays
K1 Fingerprint recognition
K1 Distortion
K1 Bonding
K1 Three-dimensional integrated circuits
K1 Next generation networking
K1 3D integration
K1 Wafer-to-wafer bonding
K1 Hybrid bonding
K1 Bonding overlay accuracy
K1 Distortion correction
SP 1
OP 2
LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535682
DO https://doi.org/10.23919/ICEP61562.2024.10535682
SF ELIB - SuUB Bremen

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