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1 Ergebnisse
1
Carbon/Nitrogen Dual-Doped inP-Type Silicon Hard Mask for W..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Chen, Yen-Shuo
;
Chiu, Tzu Wei
;
Fan, Hua-Tai
... - p. 1-2 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535686
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Carbon/Nitrogen Dual-Doped inP-Type Silicon Hard Mask for Wafer Thinning and Dishing Less for Hybrid Bonding</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535686&Exemplar=1&LAN=DE A1 Chen, Yen-Shuo A1 Chiu, Tzu Wei A1 Fan, Hua-Tai A1 Ko, Yu-Chien A1 Chen, Chu Chi A1 Ko, Fu-Hsiang YR 2024 K1 Performance evaluation K1 Semiconductor devices K1 Integrated circuit interconnections K1 Packaging K1 Ions K1 Silicon K1 Copper K1 Carbon dope K1 Nitrogen dope K1 CMP K1 Wafer-thinning K1 Hybrid bonding SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535686 DO https://doi.org/10.23919/ICEP61562.2024.10535686 SF ELIB - SuUB Bremen
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