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1 Ergebnisse
1
Design of Panel Level Package and Power and Signal Integrit..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Ma, Yu-zhi
;
Lee, Qian
;
Wu, Sung-Mao
- p. 1-2 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535687
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Design of Panel Level Package and Power and Signal Integrity Analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535687&Exemplar=1&LAN=DE A1 Ma, Yu-zhi A1 Lee, Qian A1 Wu, Sung-Mao YR 2024 K1 Impedance matching K1 Crosstalk K1 Focusing K1 Packaging K1 Manufacturing K1 SDRAM K1 Impedance K1 Panel level packaging K1 RDL K1 BGA K1 Power integrity K1 Signal integrity SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535687 DO https://doi.org/10.23919/ICEP61562.2024.10535687 SF ELIB - SuUB Bremen
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