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1 Ergebnisse
1
Large-Scale Cu Interconnection of Organic Substrate Materia..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Shih, M. L.
;
Shih, P. S.
;
Huang, J. H.
... - p. 1-2 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535688
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Large-Scale Cu Interconnection of Organic Substrate Materials Through Electroless Plating Technology</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535688&Exemplar=1&LAN=DE A1 Shih, M. L. A1 Shih, P. S. A1 Huang, J. H. A1 Chen, I. A. A1 Wang, J. S. A1 Ko, C. T. A1 Lin, B. R. A1 Yang, K. M. A1 Lin, C. H. A1 Lee, A. S. A1 Kao, C. R. YR 2024 K1 Thermal expansion K1 Integrated circuit interconnections K1 Plating K1 Packaging K1 Trajectory K1 Copper K1 Bonding K1 Organic substrate K1 Fan-Out wafer level packaging K1 Cu-to-Cu bonding K1 Electroless plating SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535688 DO https://doi.org/10.23919/ICEP61562.2024.10535688 SF ELIB - SuUB Bremen
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