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1 Ergebnisse
1
Metal Sinter Material Technology for Power Module Packaging:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Chao, Chen-Chun
;
Yang, Yi-Chi
;
Jeng, Jyh-Long
- p. 1-2 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535690
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Metal Sinter Material Technology for Power Module Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535690&Exemplar=1&LAN=DE A1 Chao, Chen-Chun A1 Yang, Yi-Chi A1 Jeng, Jyh-Long YR 2024 K1 Temperature measurement K1 Silver K1 Temperature K1 Metals K1 Sintering K1 Conductivity K1 Tin K1 Ag Sintering K1 Chiplet packaging K1 Thermal and electrical conductive compositions K1 Metallic materials & processes K1 Automotive and IoT applications SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535690 DO https://doi.org/10.23919/ICEP61562.2024.10535690 SF ELIB - SuUB Bremen
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