I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Direct Observation of Void Nucleation and Growth in a 2-µm-..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Liang, Chien-Lung
;
Lin, Yung-Sheng
;
Tsai, Min-Yan
... - p. 1-2 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535693
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Direct Observation of Void Nucleation and Growth in a 2-µm-Wide Cu Redistribution Line During In Situ Electromigration</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535693&Exemplar=1&LAN=DE A1 Liang, Chien-Lung A1 Lin, Yung-Sheng A1 Tsai, Min-Yan A1 Chiu, Meng-Chun A1 Wang, Shan-Bo A1 Hung, Chih-Pin A1 Lin, Kwang-Lung YR 2024 K1 Electromigration K1 Grain boundaries K1 Scanning electron microscopy K1 Failure analysis K1 Polyimides K1 Packaging K1 Dielectrics K1 In situ electromigration K1 Cu RDL K1 Void K1 Failure mechanism K1 Fan-out interconnection packaging SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535693 DO https://doi.org/10.23919/ICEP61562.2024.10535693 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
