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1 Ergebnisse
1
Solder Joint Lifetime Characterization of a SiC Power MOSFE..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Wang, He-Hong
;
Cheng, Hsien-Chie
;
Liu, Yan-Cheng
... - p. 1-2 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535694
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Solder Joint Lifetime Characterization of a SiC Power MOSFET Module Under Power Cycling</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535694&Exemplar=1&LAN=DE A1 Wang, He-Hong A1 Cheng, Hsien-Chie A1 Liu, Yan-Cheng A1 Syu, Ji-Yuan A1 Kao, Kuo-Shu A1 Chang, Tao-Chih YR 2024 K1 Semiconductor device modeling K1 MOSFET K1 Silicon carbide K1 Computational modeling K1 Computational fluid dynamics K1 Multichip modules K1 Predictive models K1 SiC MOSFET K1 Accelerated Power cycling K1 Solder joint K1 Design-for-Reliability K1 Anand model K1 Damage criteria SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535694 DO https://doi.org/10.23919/ICEP61562.2024.10535694 SF ELIB - SuUB Bremen
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