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1 Ergebnisse
1
Dvelopment of novel low dielectric epoxy resin:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Tanaka, Kentaro
;
Nishimura, Masanari
;
Kida, Noriyuki
. - p. 1-2 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535699
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Dvelopment of novel low dielectric epoxy resin</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535699&Exemplar=1&LAN=DE A1 Tanaka, Kentaro A1 Nishimura, Masanari A1 Kida, Noriyuki A1 Watanabe, Takaaki YR 2024 K1 Workability K1 Systematics K1 Dielectric constant K1 Fluorine K1 Epoxy resins K1 Focusing K1 Propagation losses K1 epoxy resin K1 low dissipation factor K1 high frequency K1 high adhesion K1 five generation SP 1 OP 2 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535699 DO https://doi.org/10.23919/ICEP61562.2024.10535699 SF ELIB - SuUB Bremen
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