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1 Ergebnisse
1
Fracture Properties Characterization of Multi-Layer Ceramic..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Lee, Po-Yi
;
Chen, Kuo-Shen
;
Chiu, Tz-Cheng
... - p. 285-286 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535703
RT T1
2024 International Conference on Electronics Packaging (ICEP)
: T1
Fracture Properties Characterization of Multi-Layer Ceramic Capacitors for Device Longevity Assessment
UL https://suche.suub.uni-bremen.de/peid=ieee-10535703&Exemplar=1&LAN=DE A1 Lee, Po-Yi A1 Chen, Kuo-Shen A1 Chiu, Tz-Cheng A1 Yang, Tian-Shiang A1 Ho, Ching-Jenq A1 Chen, Lien-Wen YR 2024 K1 Performance evaluation K1 Temperature dependence K1 Temperature K1 Thermomechanical processes K1 Printed circuits K1 Sintering K1 Ceramic capacitors K1 Multi-Layer Ceramic Capacitors (MLCC) K1 Fracture Toughness K1 Hardness K1 Indentation Tests SP 285 OP 286 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535703 DO https://doi.org/10.23919/ICEP61562.2024.10535703 SF ELIB - SuUB Bremen
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