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1 Ergebnisse
1
Large Panel Fan-Out Process for High Performance Computing ..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Lu, Powei
;
Weng, Jia Sang
;
Yang, F S
.. - p. 67-68 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535705
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Large Panel Fan-Out Process for High Performance Computing Device application with Micro Ball Mount Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535705&Exemplar=1&LAN=DE A1 Lu, Powei A1 Weng, Jia Sang A1 Yang, F S A1 Yang, Jeffrey A1 Fang, Jen-Kuang YR 2024 K1 Mass production K1 Costs K1 High performance computing K1 Production K1 System integration K1 Packaging K1 Distance measurement K1 FOPLP K1 ball mount K1 panel process K1 fan-out SP 67 OP 68 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535705 DO https://doi.org/10.23919/ICEP61562.2024.10535705 SF ELIB - SuUB Bremen
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