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1 Ergebnisse
1
Eutectic Bonding in Sequential Bi and Sn Layers for Low-Tem..:
, In:
2024 International Conference on Electronics Packaging (ICEP)
,
Rajendran, Sri Harini
;
Jung, Jae Pil
;
Jung, Chul Hwa
. - p. 277-278 , 2024
Link:
https://doi.org/10.23919/ICEP61562.2024.10535706
RT T1 <cTitle>2024 International Conference on Electronics Packaging (ICEP)</cTitle>: T1 <Title>Eutectic Bonding in Sequential Bi and Sn Layers for Low-Temperature Interconnections</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-10535706&Exemplar=1&LAN=DE A1 Rajendran, Sri Harini A1 Jung, Jae Pil A1 Jung, Chul Hwa A1 Seo, Seong Min YR 2024 K1 Nanoparticles K1 Punching K1 Refining K1 Bismuth K1 Acoustics K1 Reliability K1 Bonding K1 Hybrid bonding K1 electroplating K1 SAC 305 K1 Shear Strength SP 277 OP 278 LK http://dx.doi.org/https://doi.org/10.23919/ICEP61562.2024.10535706 DO https://doi.org/10.23919/ICEP61562.2024.10535706 SF ELIB - SuUB Bremen
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